TAIPEI – Top global chipmaker Taiwan Semiconductor Manufacturing Co. and Arizona-headquartered Amkor have agreed to work together on advanced chip packaging on US soil, marking a victory in their efforts to land critical American chip supply chain technology.
TSMC and Amkor, the world's No. 2 chip packaging and test service provider, announced their memorandum of understanding on Friday. The joint statement said it would be the first time such production, all currently based in Taiwan, would be set up in the United States. The deal will expand the US semiconductor ecosystem and accelerate the product cycle.